聯電2303.TW AI Analysis
TW StockSemiconductor
(No presentation for 2303)
2303 Dividend Score
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2303 Dividend Reference Factor
Avg. Yield
4.87%
Avg. Volatility
27.2%
Avg. Filling Rate
83.33%
Avg. Filling Days
69.2
Consequent Years
10
Historical Dividend Policy
| Year | Cash Dividend | Stock Dividend | Total | Filling Days | Dividend Yield | EPS | Payout Ratio |
|---|---|---|---|---|---|---|---|
| 2016 | 0.57 | 0 | 0.57 | 233 | 4.56% | 0.23 | 51% |
| 2017 | 0.5 | 0 | 0.5 | 3 | 3.62% | 0.36 | 74% |
| 2018 | 0.71 | 0 | 0.71 | 7 | 4.2% | 0.58 | 89% |
| 2019 | 0.59 | 0 | 0.59 | 90 | 4.12% | 0.25 | 98% |
| 2020 | 0.8 | 0 | 0.8 | 2 | 5.03% | 0.74 | 101% |
| 2021 | 1.6 | 0 | 1.6 | 1 | 3.25% | 1.83 | 68% |
| 2022 | 3 | 0 | 3 | 150 | 6.48% | 3.35 | 0% |
| 2023 | 3.6 | 0 | 3.6 | 128 | 7.25% | 2.58 | 52% |
| 2024 | 3 | 0 | 3 | - | 5.57% | 1.95 | 62% |
| 2025 | 2.85 | 0 | 2.85 | - | 6.46% | 1.34 | 76% |
Dividend Distribution and Dividend Yield
2016 Filling Days: 233
$0.57 (Incl. Stock Dividend $0)
2017 Filling Days: 3
$0.5 (Incl. Stock Dividend $0)
2018 Filling Days: 7
$0.71 (Incl. Stock Dividend $0)
2019 Filling Days: 90
$0.59 (Incl. Stock Dividend $0)
2020 Filling Days: 2
$0.8 (Incl. Stock Dividend $0)