麗正2302.TW AI Analysis
TW StockSemiconductor
(No presentation for 2302)
麗正（2302）Dividend Score
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Avg. Yield
1.53%
Avg. Volatility
43.03%
Avg. Filling Rate
90.91%
Avg. Filling Days
41.2
Consequent Years
5
Historical Dividend Policy
| Year | Cash Dividend | Stock Dividend | Total | Filling Days | Dividend Yield | EPS | Payout Ratio |
|---|---|---|---|---|---|---|---|
| 2016 | 0.02 | 0 | 0.02 | 1 | 0.39% | 0.11 | 80% |
| 2017 | 0 | 0 | 0 | - | 0% | - | - |
| 2018 | 0 | 0 | 0 | - | 0% | - | - |
| 2019 | 0 | 0 | 0 | - | 0% | - | - |
| 2020 | 0 | 0 | 0 | - | 0% | - | - |
| 2021 | 0.3 | 0 | 0.3 | 1 | 1.8% | 0.38 | 47% |
| 2022 | 0.6 | 0 | 0.6 | 2 | 3.75% | 0.56 | 118% |
| 2023 | 0.8 | 0 | 0.8 | 2 | 4.03% | 0.31 | 76% |
| 2024 | 0.31 | 0 | 0.31 | 3 | 1.69% | 0.3 | 59% |
| 2025 | 0.58 | 0 | 0.58 | 42 | 3.65% | 0.02 | 77% |
Dividend Distribution and Dividend Yield
2016 Filling Days: 1
$0.02 (Incl. Stock Dividend $0)
2017 Filling Days: 0
$0 (Incl. Stock Dividend $0)
2018 Filling Days: 0
$0 (Incl. Stock Dividend $0)
2019 Filling Days: 0
$0 (Incl. Stock Dividend $0)
2020 Filling Days: 0
$0 (Incl. Stock Dividend $0)